1、PCB(Printed Circuit Board)印制電路板
2、DFM(Design for manufacturability)可制造性設計
3、DFT(Design for testability)可測性設計
4、DRC(Design Rule Check)設計規則檢查
5、ICT(In-Circuit Test)在線測試
6、EMI(Electromagnetic Interference)電磁干擾
7、EMC(Electromagnetic Compatibility)電磁兼容性
8、SI(Signal integrity)信號完整性
9、PI(Power integrity)電源完整性
10、DDR (Double Data Rate SDRAM)雙倍速率 SDRAM
11、HDI(High Density Interconnect)高密度互連
12、FPC(Flexible Printed Circuit)柔性電路板
13、BGA((Ball Grid Array)球柵陣列封裝器件
14、THT(Through Hole Technology)通孔插件技術
15、BOM(Bill of materials)材料清單
16、SMT (Surface Mounted Technology)表面組裝技術
17、DIP(dual-in-line package)雙列直插式封裝
18、SIP(single-inline package)單列直插式封裝
19、SOIC(small-outline integrated circuit)小外型集成電路
20、ISO(International Organization for Standardization)國際標準化組織